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Dr. Rahul Panat's Advanced Manufacturing Lab

Lab wins commercialization gap fund

Dr. Panat won the commercialization gap fund from WSU’s office of commercialization for his project titled ‘Highly Stretchable Metallic Interconnects for Flexible Electronics ‘. This $40,000 award (with Dr. Indranath Dutta as co-PI) will help in bridging the critical gap between the discovery of this idea and its commercialization.

Invited Seminar at the Air Force Research Laboratory (AFRL)

Dr. Panat gave in invited seminar at the Air Force Research Laboratory (AFRL), Dayton, OH, in their Materials and Manufacturing Directorate. The talk was titled “Printed and Flexible Microelectronics for Smart Devices and Systems”. He also learnt about the exciting work in Flexible Microelectronics and 3-D Additive Printing currently being pursued at DoD.

Talk at Carnegie Mellon University

Dr. Panat gave a seminar at the Carnegie Mellon University (CMU) in their ME department titled “Printed and Flexible Microelectronics Manufacturing for Smart Devices and Systems”. Through discussions with several faculty members, he also learnt about the exciting work in microelectronics and 3-D additive manufacturing currently being pursued at CMU.

Seminar at the 43rd ICMCTF

Dr. Panat gave a talk at the 43rd ICMCTF (International Conference of Metallurgical Coatings and Thin Films) conference in San Diego in the High Temperature Coatings session. The title of the talk was, “Electrical Characterization of Additively Manufactured Metal Films for High Temperature Sensor Applications”.