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Department of Physics and Astronomy Collins Research Group

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Physical Vapor Deposition

The Angstrom Engineering NexDep is fully computer automated for multilayer-multisource thin film physical vapor deposition. The tool is coupled into the glovebox to eliminate exposure to the atmosphere and enables pumpdown to <1×10^-7 Torr base pressure in <20 minutes. Six sources includes four thermal sources for metals and two temperature-controlled RADAK sources for small molecule deposition.

1- Types of materials which can be evaporated using PVD (those are just a few examples):

  • Metals (with low or high melting points) e.g. Au, Al, In, Ag, Cr and Ti. Resistive sources/boats are used to evaporate metals. One of the sources has the capability to get to as high temperature as ~ 2000 C and has a chilled water cooling kit.
  • Oxides, e.g. MnO3, silica, silica networks, CaSiO3
  • Organic materials (small molecules and fullerenes), e.g. ZnPc, CuPc, F16CuPc, C60, and C70. Radak sources are used to evaporate organic materials

2- The substrate holder is 6″ x 6″ and can accommodate for different shapes and sizes of substrates, e.g. patterned Si, glass substrates, rods, bars, plates, etc. Also, the PVD has the capability of heating substrates up to ~ 400 C and cooling them down to ~ -150 C (using liquid nitrogen).

3- The PVD system is capable of using different sources to evaporate more than one material simultaneously which allows for co-deposition of materials, if desired.